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Copper Powder Products
| Copper powder products are classified by purity,
production method, grain and density. Variations in the shape of copper
particles, density and the surface condition of particles greatly affect
the usability of copper powder for certain applications.
Following are some of the most widely
used copper powder products. |
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CU165
Copper Powder 99.3%, General Purpose, 150
Mesh
The most popular and widely used copper powder,
produced by water atomization method followed by hydrogen reduction.
Additional Description
Product Details:
Purity: 99.3%
Apparent Density: 2.7 g/cc
Nominal Mesh: -140
-325 mesh ratio > 50%
Application: General purpose, brazing, chemical, electronics, paints, ...
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CU155A
Copper Powder 99.5% - 99.9%
Very high purity, air atomized, hydrogen
reduced ultra fine copper powder. Spherical particle. High conductivity. High
Density.
Additional Description
Product Specifications
| Purity |
99.81% |
| Iron |
0.01% |
| Hydrogen Loss |
0.18% |
| Apparent Density |
4.89 g/cc |
| Sieve Analysis |
+200 Mesh: 0%
-200/+325 Mesh: 4.8%
-325 Mesh: 95.2%
|
| HTS Code |
7406.10.0000 |
| NMFC |
30743 |
| CAS No. |
7440-50-8 |
| Product Code |
CU112SP |
Recommended for:
- Thick and Thin Film pastes
- Capacitor Chips
- End cap Terminators
- Conductive Inks, paints and pastes
- Injection Molding
- Electronics
- Thermal management
- EDM Electrodes
- Thermal Sprays
- Sintered alloys/ products
- Brazing/ soldering paste
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Typical Analysis:
Copper: 99.81%
Iron: 0.01%
Hydrogen Loss: 0.18%
Apparent Density: 4.89 g/cc
SIEVE ANALYSIS
+200 MESH: 0%
-200+325 MESH: 4.8%
-325 MESH: 95.2%
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CU301-E
Copper Powder 99.8%, Electronic Grade, Mesh
325
Electronic grade Copper powder, high purity,
water atomized, hydrogen reduced ultra fine copper powder with spheroidal
particles. Higher conductivity. Lower Density.
Additional Description
Product Specifications
| Purity |
99.85% |
| Hydrogen Loss |
0.19% |
| Apparent Density |
2.97 g/cc |
| Mesh Size |
325 mesh |
| Sieve Analysis |
+60 Mesh: 0%
-60/+80 Mesh: 0%
-80/+100 Mesh: 0%
-100/+140 Mesh: Trace
-140/+200 Mesh: Trace
-200/+325 Mesh: 0.6%
-325 Mesh: 99.4% |
| HTS Code |
7406.10.0000 |
| NMFC |
30743 |
| CAS No. |
7440-50-8 |
Recommended for:
- Thick and Thin Film pastes
- Capacitor Chips
- End cap Terminators
- Conductive Inks, paints and pastes
- Injection Molding
- Electronics
- Thermal management
- EDM Electrodes
- Thermal Sprays
- Sintered alloys/ products
- Brazing/ soldering paste
|
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Typical Analysis:
Copper: 99.85%
Hydrogen Loss: 0.19%
Apparent Density: 2.97 g/cc
SIEVE ANALYSIS
+60 MESH: 0%
-60/+80 MESH: 0%
-80/+100 MESH: 0%
-100/+140 MESH: TR
-140/+200 MESH: TR
-200/+325 MESH: 0.6%
-325 MESH: 99.4%
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CUPDR
COPPER POWDER 99.9% (150 Mesh)
Highly pure 99.9% copper powder made from
electrolytic copper. Mesh 150 Granular Copper.
Additional Description
variety of uses in the electrical and
electronic industries because of its excellent electrical and thermal
conductivities. Also used in self-lubricating bearing ,brazing, cold
soldering, and mechanical plating, as well as for antifouling paints,
decorative and protective coatings and printing inks. medals and medallions,
metal-plastic decorative products and a variety of chemical and medical
purposes.
Product Specifications
| Purity |
>99% |
| Mesh Size |
150 - 325 |
| Screen Analysis |
+60: 0.0%
-60/+100: 0.7%
-100/+200: 89.7%
-200/+325: 9.1%
-325: 0.5%
|
Applications and Benefits:
- Electrical and electronic applications
- Self-lubricating bearings
- Brazing and cold soldering
- Mechanical plating
- Antifouling paints and decorative coatings
- Printing inks
- Medals, medallions, and metal-plastic decorative products
- Chemical and medical purposes
|
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| Analysis in percent |
....... |
Screen Analysis |
| 60 |
|
0.0 |
| 60-100 |
|
0.7 |
| 100-200 |
|
89.7 |
| 200-325 |
|
9.1 |
| 325 |
|
0.5 |
Apparent Density: 3 g/cc
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CU12HP
Copper Granules, 16 Mesh
Coarse copper powder for wood inlay and industrial applications.
Additional Description
Coarse copper powder composed of high-purity metallic copper. Particles are solid, nearly uniform in size, and feature the appearance of metallic spherical crystals. Recommended for wood inlay, art projects, and industrial applications where solid round multi-sided balls are suitable. In laboratory settings, granular copper is utilized for sulfur removal from environmental samples. CAS No.: 7440-50-8.
Product Specifications
| Mesh Size |
16 |
| Material |
High-purity Copper |
| Particle Shape |
Spherical, metallic crystals |
| CAS Number |
7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial processes
- Laboratory sulfur removal from environmental samples
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|
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CU23HP
Copper Granules, Mesh 20 (Coarse Copper Powder)
High-purity coarse copper powder with spherical metal crystals.
Additional Description
Coarse copper powder made of solid metallic high-purity copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples.
Product Specifications
| Copper |
99.84% |
| Apparent Density |
5.29 g/cc |
| Sieve Analysis (Typical) |
+20 mesh: 0%
-20/+30 mesh: 100%
-30/+40 mesh: 0.0%
-40 mesh: 0.0% |
| CAS No. |
7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
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|
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CU35HP
Copper Granules, 35 Mesh (Coarse Copper Powder)
High-purity coarse copper granules, spherical, 35 mesh size.
Additional Description
Coarse copper powder made of solid metallic high-purity copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples. Coarse 35 mesh size, with granules approximately 0.5 mm in diameter.
Product Specifications
| Mesh Size |
35 mesh |
| Granule Diameter |
Approximately 0.5 mm |
| CAS No. |
7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
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|
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CU7005F
Copper Powder, Flaked, Waxed, Pigment
Artistic, metallic-shine copper powder for inks and paints.
Additional Description
Copper Powder offers exceptional metallic shine, ideal for metallic inks and paints. Compatible with most resins and conductive for ink creation.
Product Specifications
| Type |
Copper Powder |
| Use |
Metallic Inks, Paints |
| Compatibility |
Polyurethane, Polyacrylic, Polyester |
| Conductivity |
Suitable for Conductive Inks |
| Pigment Quality |
Art Grade |
Similar Products
- Metallic-shine gold powder for inks
- Silver pigment powder, art-grade
- Bronze powder, resin-compatible
- Reflective aluminum powder, versatile
- Artistic brass powder for painting
|
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CU112SP
Copper Powder, Super Fine, Spherical
High-density copper powder for superior conductivity and casting.
Additional Description
CU112SP is a super fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products.
Our specification guarantees that at least 95% of this powder are particles smaller than 44 micron. A typical analysis however shows that 99.9% of particles are smaller than 44 micron. Most particles are between 10 micron and 22 micron.
HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8
Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Old product code: CU155A
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Product Specifications| Particle Size | 95% < 44 microns | | Purity | > 99.2% Copper | | Apparent Density | 4.5 - 5.5 g/cc | | Hydrogen Loss | < 0.7% | | Mesh Passing | 99.9% through 325 (44 micron) |
Similar Products- Fine silver powder, high conductivity
- Spherical bronze powder, 3D printing
- Fine aluminum powder, thermal conductivity
- High-purity zinc powder, corrosion resistance
- Spherical titanium powder, lightweight strength
|
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CU118SP
Copper Powder, Fine, Spherical
High-purity, high-density spherical copper powder for enhanced conductivity and versatility.
Additional Description
CU118SP is a fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products.
Our specification guarantees that at least 80% of this powder are particles smaller than 44 micron. A typical analysis however shows that 88% of particles are smaller than 44 micron. Most particles are between 16 micron and 28 micron.
Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Product Specifications:
| Copper Purity |
Over 99.5% |
| Hydrogen Loss |
Less than 0.7% |
| Apparent Density |
4.5-5.5 g/cc |
| Typical Analysis |
Copper > 99.5% Hydrogen Loss < 0.7%
Apparent Density, g/cc: 4.5 - 5.5
Passing mesh 325 (44 micron): 80% ~ 88% |
Similar Products:
- Ultra-Fine Copper Powder
- High-Purity Copper Foil
- Copper Wire
- Copper Rod
- Copper Sheet
|
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CU301
Copper Powder 99.3%, Mesh 325
Ultra-fine, high-purity copper powder with spheroidal particles.
Additional Description
Ultra-fine, high-purity copper powder made via water atomization and hydrogen reduction. Features spheroidal particles and clusters, offering higher conductivity and lower density. Suitable for metal injection molding and applications requiring high conductivity and purity. Typical applications include conductive inks, paints, pastes, thermal sprays, and sintered products. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity |
99.31% |
| Hydrogen Loss |
0.39% |
| Apparent Density |
2.97 g/cc |
| Mesh Size |
325 mesh |
| Sieve Analysis |
+60 Mesh: 0%
-60/+80 Mesh: 0%
-80/+100 Mesh: 0%
-100/+140 Mesh: Trace
-140/+200 Mesh: Trace
-200/+325 Mesh: 0.6%
-325 Mesh: 99.4%
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| HTS Code |
7406.10.0000 |
| NMFC |
30743 |
| CAS No. |
7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
|
 |
Check price and availability
CU264
Copper Powder, 99.5%, Mesh 100
High purity copper powder for powder metallurgy.
Additional Description
High purity copper powder, nominal mesh 100, Apparent density: 2.6 g/cc, Copper > 99.5%, with irregular shape particles. Used in powder metallurgy. May be admixed with other metal powders and graphite for specific properties such as strength, hardness and wear resistance for structural parts.
HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Product Specifications
| Apparent Density | 2.6 g/cc | | Purity | > 99.5% Copper | | Particle Shape | Irregular | | Conductivity | At higher voltages/when compacted | | Applications | Powder Metallurgy, Alloys |
Similar Products
- High purity bronze powder, metallurgy
- Fine granular aluminum powder, industrial
- Nickel powder, high density, 99% purity
- Spherical zinc powder, corrosion-resistant
- Iron powder, magnetic, for alloys
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CU279
Copper Powder 99+%, Mesh 200
High-purity, fine copper powder with irregular particles, mesh 200.
Additional Description
High-purity copper powder made via water atomization and hydrogen reduction. Features very fine, irregular particles and clusters with relatively lower density. Recommended for applications requiring high purity and conductivity, including diamond wheels, sintering, and chemical reactions. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
| Purity |
99.3% |
| Hydrogen Loss |
0.39% |
| Apparent Density |
2.6 - 2.8 g/cc |
| Mesh Size |
200 mesh |
| Sieve Analysis |
+100 Mesh: Trace
+140 Mesh: 1% Max
+200 Mesh: 3% Max
+325 Mesh: Balance
-325 Mesh: 90% Min
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| HTS Code |
7406.10.0000 |
| NMFC |
30743 |
| CAS No. |
7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
- Diamond wheels
- Chemical reactions
|
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CU41
CU41, Copper Powder, Mesh 40 (Coarse)
High purity, dark-colored, coarse copper powder.
Additional Description
High purity atomized copper powder -40/ 100 US Mesh has the largest grains compared with our other copper powder products. It is also usually darker in color. Minimum purity: 99.0%. Typical Apparent Density: 2.4. Nominal Mesh: -40/ 100. HTS Code: 7406.10.0000. NMFC: 30743. CAS: 7440-50-8. Typical Analysis: Copper: 99.87%, Hydrogen Loss: 0.21%, Apparent Density: 2.57 g/cc. Sieve Analysis: 40 mesh 0%, -40/ 100 mesh 90.4%, -100/ 140 mesh 9%, -140 mesh 0.6%.
Product Specifications| Purity | 99.87% | | Hydrogen Loss | 0.21% | | Apparent Density | 2.57 g/cc | | Mesh Size | >40 mesh 0%
-40/ 100 mesh 90.4%
-100/ 140 mesh 9%
-140 mesh 0.6% | | HTS Code | 7406.10.0000 | | NMFC | 30743 | | CAS Number | 7440-50-8 |
Similar Products
- Fine grain, 99% pure copper powder
- Medium grain, dark copper powder
- High-density, fine copper powder
- Coarse, 98% pure copper flakes
- Atomized, spherical copper granules
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Please contact 973-405-6247 to discuss your
specific requirements based on your applications.
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